| 流程 | 工站 | 检查项目 |
|---|---|---|
| Process | work station | Inspection items |
| I P Q C | 钻孔 Drilling |
孔粗/板厚/孔径测量 Hole wall roughness/Thickness/Hole diameter |
| 外观检查 Appearance inspection |
||
| 沉铜 PTH |
背光检测 Backlight test |
|
| 板电 Full plate electroplating |
孔/面铜 Hole/surface copper |
|
| 外观检查 Appearance inspection |
||
| 干膜 Dry film |
外观检查 Appearance inspection |
|
| 线宽/距测试 Trace width/spacing test |
||
| 图电 Graphic plating |
孔/面铜厚度 Hole/surface copper thickness |
|
| AOI | ||
| 蚀刻 / AOI Etching/AOI |
热应力测试 Thermal stress test |
|
| 线宽/距检查 Trace width/spacing inspection |
||
| I P Q C | 防焊 Solder Mask |
外观检查 Appearance inspection |
| 油墨厚度测量 Ink thickness |
||
| 拉力测试, 硬度测试 Tensile testing, hardness testing |
||
| IQC | 表面处理 Surface treatment |
外观检查 (表面处理检测报告) Visual inspection (Finishing test report) |
| I P Q C | 成型 Routing |
外型尺寸检查 Size check |
| 外观检查 Visual inspection |
||
| F Q C | F Q C | Visual Inspection |
| 板曲矫正 / 检查 | ||
| Warpage check | ||
| F Q A | F Q A | 外观检查 Visual Inspection |
| 孔面 / 铜, 介质层厚度测量 The hole/surface copper, dielectric measurements |
||
| 拉力测试 / 可焊性测试 / 热应力测试 Tensile testing / Solder ability Testing / Thermal stress test |
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